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A comparative study of Cn/Sn/Cu and Ni/Sn/Ni solder joints for low temperature stable transient liquid phase bonding - ScienceDirect
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Figure 2.6 from Pressure dependence of the SnP phase diagram and investigations in the ternary system | Semantic Scholar
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Ni–Sn phase diagrams. Full line: evaluated diagram from [18]; dashed... | Download Scientific Diagram
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Effects of Ag addition and Ag3Sn formation on the mechanical reliability of Ni/Sn solder joints - ScienceDirect
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Homogeneous (Cu, Ni)6Sn5 intermetallic compound joints rapidly formed in asymmetrical Ni/Sn/Cu system using ultrasound-induced transient liquid phase soldering process - ScienceDirect
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Calculated Ni-Sn binary phase diagram using thermodynamic parameters... | Download Scientific Diagram
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