![AN-772: A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP) | Analog Devices AN-772: A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP) | Analog Devices](https://www.analog.com/-/media/analog/en/app-note-images/an-772/figure-2.png?w=435)
AN-772: A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP) | Analog Devices
DRV8832-Q1: About PCB Footprint and Land pattern - Motor drivers forum - Motor drivers - TI E2E support forums
![AN-772: A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP) | Analog Devices AN-772: A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP) | Analog Devices](https://www.analog.com/-/media/analog/en/app-note-images/an-772/figure-14.png?w=435)
AN-772: A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP) | Analog Devices
![AN-772: A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP) | Analog Devices AN-772: A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP) | Analog Devices](https://www.analog.com/-/media/analog/en/app-note-images/an-772/figure-25.png?w=577&imgver=1)
AN-772: A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP) | Analog Devices
![AN-772: A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP) | Analog Devices AN-772: A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP) | Analog Devices](https://www.analog.com/-/media/analog/en/app-note-images/an-772/figure-10.png?w=577&imgver=1)
AN-772: A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP) | Analog Devices
![AN-772: A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP) | Analog Devices AN-772: A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP) | Analog Devices](https://www.analog.com/-/media/analog/en/app-note-images/an-772/figure-5.png?w=900&imgver=1)
AN-772: A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP) | Analog Devices
![AN-772: A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP) | Analog Devices AN-772: A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP) | Analog Devices](https://www.analog.com/-/media/analog/en/app-note-images/an-772/figure-15.png?w=435)
AN-772: A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP) | Analog Devices
![AN-772: A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP) | Analog Devices AN-772: A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP) | Analog Devices](https://www.analog.com/-/media/analog/en/app-note-images/an-772/figure-13.png?la=en&imgver=1)
AN-772: A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP) | Analog Devices
![The Difference between Footprints and Land Patterns - Printed Circuit Board Manufacturing & PCB Assembly - RayMing The Difference between Footprints and Land Patterns - Printed Circuit Board Manufacturing & PCB Assembly - RayMing](https://www.raypcb.com/wp-content/uploads/2021/03/c4ca4238a0b9238-20.jpg)